Dependence of Cu/Sn and Cu/60Sn40Pb Solder Joint Strength on Diffusion Controlled Growth of Cu3Sn and Cu6Sn5
- 1 January 1984
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
The growth of intermetallic compounds and the strength of Cu/ Sn and Cu/ 60Sn40Pb butt joints were studied as a function of isothermal aging. The effects of single-crystal (100), (110), and (111) oriented copper on the growth rates of Cu3Sn and Cu6Sn5 intermetallic compounds are characterized and the influence of elevated temperature aging on the tensile strength of butt joints analyzed. Substrate orientation appears to influence the growth rate. Metallographic measurements showed that the intermetallic compounds grew at a rate proportional to the square root of time. Tensile tests of aged butt joints revealed a more complex time dependence.Keywords
This publication has 11 references indexed in Scilit:
- Diffusion in the CuSn binary system: application to Nb3Sn compositesJournal of Materials Science, 1984
- Atom motions of copper dissolved in lead-tin alloysPhysical Review B, 1983
- Kinetics of interfacial reaction in bimetallic CuSn thin filmsActa Metallurgica, 1982
- Interdiffusion and formation of intermetallic compounds in tin-copper alloy surface coatingsSurface Technology, 1977
- Reaction-Diffusion in the Cu–Sn SystemTransactions of the Japan Institute of Metals, 1975
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973
- A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and its AlloysTransactions of the IMF, 1973
- The ϵ-phase in the CuSn systemActa Metallurgica, 1970
- The Strength of Soldered JointsMetal Science Journal, 1968
- Interstitial Diffusion of Copper in TinJournal of Applied Physics, 1967