New Information on High Copper Amalgam Corrosion
- 1 May 1978
- journal article
- research article
- Published by SAGE Publications in Journal of Dental Research
- Vol. 57 (5-6) , 725-729
- https://doi.org/10.1177/00220345780570051301
Abstract
Anodic polarization of "pure" Cu6 Sn5 was investigated. Cu 6 Sn5 is found to be passive in nearly neutral synthetic saliva. Anodic corrosion activity (characteristic for tin) previously reported for a high copper amalgam must result from the presence of the γ 2 phase or tin in the matrix phase.Keywords
This publication has 2 references indexed in Scilit:
- Electrochemistry of the saline corrosion of conventional dental amalgamsJournal of Oral Rehabilitation, 1975
- Investigation of Copper-Manganese-Nickel Alloys for Dental PurposesJournal of Dental Research, 1971