Enhanced solder alloy performance by magnetic dispersions
- 1 September 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 17 (3) , 452-457
- https://doi.org/10.1109/95.311755
Abstract
New Pb-free solder alloys with improved resistance to deformation and creep have been developed by dispersion hardening with essentially noncoarsening particles. Application of a magnetic field to molten solders containing fine (Keywords
This publication has 3 references indexed in Scilit:
- Hard‐particle Reinforced Composite Solders Part 1: MicrocharacterisationSoldering & Surface Mount Technology, 1997
- New Pb-free solder alloy with superior mechanical propertiesApplied Physics Letters, 1993
- Composite soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991