The temperature dependence of component failure rate
- 1 January 1980
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 20 (3) , 297-307
- https://doi.org/10.1016/0026-2714(80)90211-5
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Accelerated vibration fatigue life testing of leads and soldered jointsMicroelectronics Reliability, 1976
- Research Toward a Physics of Aging of Electronic Component PartsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1963