A Comparative Study on Electromigration Failure Mechanism Between Near-Bamboo and Bamboo Al(Cu) Two-Level Structure
- 1 January 1995
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Electromigration Induced Shallow Junction Leakage with Al/Poly‐Si MetallizationJournal of the Electrochemical Society, 1983
- Linewidth dependence of electromigration in evaporated Al-0.5%CuApplied Physics Letters, 1980
- Electromigration in thin gold films on molybdenum surfacesThin Solid Films, 1975