Thermal and electrical ageing of DBC substrates
- 13 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 4 (02759306) , 1955-1960
- https://doi.org/10.1109/pesc.2001.954408
Abstract
In LEG-INPG, a test bench has been developed in order to identify and to study ageing indicators of DBC (direct bond copper) used in power electronic modules. For reproducibility purposes, the approach that has been considered consists in a macroscopic analysis. As a result, partial discharges are not observed nor quantified. In this paper, the leakage current of DBC is used as the main ageing indicator. First the bench, then the testing conditions and finally the limitations are presented. It relays on thermal and electrical ageing. Then, the step by step, study of the indicator is given. The progress of the study is given, and first results and comments are provided.Keywords
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