Results of comparative reliability tests on lead-free solder alloys
- 25 June 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1232-1237
- https://doi.org/10.1109/ectc.2002.1008264
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- The deformation behavior of Sn62Pb36Ag/sub 2/ and its implications on the design of thermal cycling tests for electronic assembliesIEEE Transactions on Electronics Packaging Manufacturing, 1999
- Preparation of soft solder jointsMaterials Characterization, 1996