The deformation behavior of Sn62Pb36Ag/sub 2/ and its implications on the design of thermal cycling tests for electronic assemblies
- 1 January 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electronics Packaging Manufacturing
- Vol. 22 (1) , 71-79
- https://doi.org/10.1109/6104.755091
Abstract
No abstract availableKeywords
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