Metallurgical considerations for accelerated testing of soft solder joints
- 24 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Constitutive relations for tin-based solder jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- A fracture mechanics approach to thermal fatigue life prediction of solder jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic PackagingJournal of Electronic Packaging, 1991
- Superplastic creep of eutectic tinlead solder jointsJournal of Electronic Materials, 1990
- Fatigue Crack Growth Under General-Yielding Cyclic-LoadingJournal of Engineering Materials and Technology, 1986
- Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed BoardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984