Modelling of charging effects caused by anodic bonding in packaged MOS devices
- 21 November 2002
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 38 (24) , 1596-1597
- https://doi.org/10.1049/el:20021044
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Low stress packaging of a micromachined accelerometerIEEE Transactions on Electronics Packaging Manufacturing, 2001
- Technology for the high-volume manufacturing of integrated surface-micromachined accelerometer productsMicroelectronics Journal, 1998