Application of CFD technology to electronic thermal management
- 1 August 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (3) , 511-520
- https://doi.org/10.1109/96.404110
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Application of a CFD tool for system-level thermal simulationIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1994