Effects of Electrode Materials and Annealing Ambients on the Electrical Properties of TiO2 Thin Films by Metalorganic Chemical Vapor Deposition
- 1 March 1997
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 36 (3S)
- https://doi.org/10.1143/jjap.36.1346
Abstract
In this work, we investigate the effects of the top electrode materials and annealing ambients on the electrical properties of chemical-vapor-deposited (CVD) TiO2 films. Experimental results indicate that the leakage current is mainly determined by the work function of electrode materials before sintering. The capacitor with TaN top electrode reveals the least leakage. After 450° C and 800° C sintering in N2, owing to its thermal stability, WN is found to be the optimal material for withstanding high-temperature thermal treatment. From the annealing ambient results, N2O was more effective than O2 in reducing leakage current, and furnace annealing in N2O ( FN2O) produces the smallest leakage. Such a phenomenon is primarily owing to the reduction of oxygen vacancies and carbon concentration in TiO2 by the atomic oxygen generated by the dissociation of N2O during the thermal cycle, thereby improving film quality.Keywords
This publication has 19 references indexed in Scilit:
- Leakage current reduction in chemical-vapor-deposited Ta2O5 films by rapid thermal annealing in N2OIEEE Electron Device Letters, 1996
- Formation and Characterization of Epitaxial TiO2 and BaTiO3/TiO2 Films on Si SubstrateJapanese Journal of Applied Physics, 1995
- TiO2 Thin Films Formed by Electron Cyclotron Resonance Plasma Oxidation at High Temperature and Their Application to Capacitor DielectricsJapanese Journal of Applied Physics, 1994
- Ulfrathin Tantalum Oxide Capacitor Process Using Oxygen‐Plasma AnnealingJournal of the Electrochemical Society, 1994
- Optimum Electrode Materials for Ta2O5 Capacitors for High- and Low-Temperature ProcessesJapanese Journal of Applied Physics, 1994
- Performance of the Plasma-Deposited Tungsten Nitride Diffusion Barrier for Al and Au MetallizationJapanese Journal of Applied Physics, 1993
- Ultrathin Tantalum Oxide Capacitor Dielectric Layers Fabricated Using Rapid Thermal Nitridation prior to Low Pressure Chemical Vapor DepositionJournal of the Electrochemical Society, 1993
- Thin TiO2 Films Prepared by Low Pressure Chemical Vapor DepositionJournal of the Electrochemical Society, 1993
- Effects of Small Amount of Water on Physical and Electrical Properties of TiO2 Films Deposited by CVD MethodJournal of the Electrochemical Society, 1988
- Electronic Properties of the Interface between Si and TiO2 Deposited at Very Low TemperaturesJapanese Journal of Applied Physics, 1986