Aligned wafer bonding: A key to three dimensional microstructures
- 1 May 1991
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 20 (5) , 383-387
- https://doi.org/10.1007/bf02670888
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Silicon nitride direct bondingElectronics Letters, 1990
- The design and fabrication of a magnetically actuated micromachined flow valveSensors and Actuators A: Physical, 1990
- A wafer-to-wafer alignment techniqueSensors and Actuators, 1989
- A Model for the Silicon Wafer Bonding ProcessJapanese Journal of Applied Physics, 1989
- A CMOS integrated silicon gas-flow sensor with pulse-modulated outputSensors and Actuators, 1988
- Micromachined packaging for chemical microsensorsIEEE Transactions on Electron Devices, 1988
- Silicon diaphragm pressure sensors fabricated by anodic oxidation etch-stopSensors and Actuators, 1988
- Silicon microcavities fabricated with a new techniqueElectronics Letters, 1986
- Wafer bonding for silicon-on-insulator technologiesApplied Physics Letters, 1986
- Fabrication of an integrated, planar silicon ink-jet structureIEEE Transactions on Electron Devices, 1979