A fine pitch probe technology for VLSI wafer testing
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Very high density probingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Membrane probe card technology (the future for higher performance wafer test)Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003