Patterning of silicon wafers using the plasma jet dry etching technique
- 1 January 1990
- Vol. 41 (4-6) , 899-901
- https://doi.org/10.1016/0042-207x(90)93816-2
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Superhigh-rate plasma jet etching of siliconApplied Physics Letters, 1989
- High rate jet plasma-assisted chemical vapour depositionThin Solid Films, 1988
- Planar Plasma Etching of Polysilicon Using CCl4 and NF 3Journal of the Electrochemical Society, 1982