Model and analyses for solder reflow cracking phenomenon in SMT plastic packages
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (8) , 940-948
- https://doi.org/10.1109/33.273696
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Analytical and experimental study for designing molding compounds for surface mounting devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Special properties of molding compound for surface mounting devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985