Characterizing metal-masked silica etch process in a CHF3/CF4 inductively coupled plasma
- 1 September 1999
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology A
- Vol. 17 (5) , 2593-2597
- https://doi.org/10.1116/1.581917
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- An optimal neural network process model for plasma etchingIEEE Transactions on Semiconductor Manufacturing, 1994
- Silica waveguides on silicon and their application to integrated-optic componentsOptical and Quantum Electronics, 1990
- Control of relative etch rates of SiO2 and Si in plasma etchingSolid-State Electronics, 1975