Thermal expansion of Ni/Cu multilayers

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Abstract
The coefficient of thermal expansion of electrodeposited Ni/Cu multilayers was obtained by measuring the evolution of membrane resonances and hence the tension as a function of temperature. The apparent thermal expansion coefficient of the multilayer membranes increases as the interface density of the multilayers increases. This increase is analyzed in terms of stress relaxation resulting from sliding of nonperfectly bonded interfaces. The analysis permits the normalization of all thermal expansion data of the Cu/Ni multilayers with layer thicknesses ranging from 20 to 800 nm but not of the thinnest layers, 2 nm thick. The results are consistent with the idea that interfacial adhesion improves as the layer thickness becomes very small, favoring epitaxial growth.

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