Simple estimate of electromigration failure in metallic thin films
- 1 February 1982
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 53 (2) , 1224-1225
- https://doi.org/10.1063/1.330531
Abstract
Electromigration failure in thin metallic films has been studied in detail for aluminum and gold. A simple expression is given here, which can be used to provide rough estimates of median time to failure for thin films of other metals, when experimental information on them is not available.This publication has 4 references indexed in Scilit:
- Diffusion processes in thin filmsThin Solid Films, 1980
- Electromigration in cobalt filmsThin Solid Films, 1976
- Electromigration and failure in electronics: An introductionProceedings of the IEEE, 1971
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969