Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Top Cited Papers
- 1 June 2002
- journal article
- review article
- Published by Elsevier in Materials Science and Engineering: R: Reports
- Vol. 38 (2) , 55-105
- https://doi.org/10.1016/s0927-796x(02)00007-4
Abstract
No abstract availableThis publication has 85 references indexed in Scilit:
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