Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections
- 1 May 2001
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 16 (5) , 1249-1251
- https://doi.org/10.1557/jmr.2001.0175
Abstract
Effects Cu and Ni additions on Au embrittlement of eutectic Sn–Pb solder interconnections during a solid-state aging treatment were evaluated using a ball shear testing method. The addition resulted in a formation of Au-containing ternary intermetallic compounds, either Au–Sn–Cu or Au–Sn–Ni phase, inside the solder matrix during aging treatment. The fracture energy of the solder interconnection containing 2.9 wt% Cu remained almost the same up to 200 h of aging treatment at 150 °C, demonstrating the possibility of suppressing the Au embrittlement by forming ternary intermetallic phases inside the solder matrix.Keywords
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