Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip chips attached to gold-capped microsocketsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The interaction kinetics and compound formation between electroless NiP and solderThin Solid Films, 1994
- Wetting behavior between solder and electroless nickel depositsMaterials Chemistry and Physics, 1994
- Atom Movement in Lead and Lead Tin SoldersMaterials Science Forum, 1984
- Diffusion of Gold and Silver in Tin Single CrystalsJournal of Applied Physics, 1966
- The Structure and Mechanical Properties of Electroless NickelJournal of the Electrochemical Society, 1965