Rheological and dielectric changes during isothermal epoxy‐amine cure

This publication has 32 references indexed in Scilit:

• Correlation between chain segment and ion mobility in an epoxy resin system. A free volume analysis
  Journal of Polymer Science Part B: Polymer Physics, 1993
• The glass transition temperature (T_g) as an index of chemical conversion for a high‐T_g amine/epoxy system: Chemical and diffusion‐controlled reaction kinetics
  Journal of Applied Polymer Science, 1990
• Free volume effects on the melt viscosity of low molecular weight poly(methyl methacrylate)
  Polymer, 1989
• The physical properties of bisphenol‐a‐based epoxy resins during and after curing. II. Creep behavior above and below the glass transition temperature
  Journal of Polymer Science Part B: Polymer Physics, 1989
• Characterisation of a bisphenol a epoxy resin. A collaborative study carried out by technical panel PTP3 of the technical cooperation programme
  British Polymer Journal, 1983
• High temperature dielectric study of epoxy resins
  Polymer Engineering & Science, 1980
• Curing of epoxide resins: Model reactions of curing with amines
  Journal of Polymer Science: Polymer Chemistry Edition, 1977
• The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-forming Liquids
  Journal of the American Chemical Society, 1955
• Studies in Newtonian Flow. III. The Dependence of the Viscosity of Liquids on Molecular Weight and Free Space (in Homologous Series)
  Journal of Applied Physics, 1952
• Studies in Newtonian Flow. I. The Dependence of the Viscosity of Liquids on Temperature
  Journal of Applied Physics, 1951