Spherical polymer particles in isotropic conductive adhesives a study on rheology and mechanical aspects
- 1 September 2010
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Isotropic conductive adhesive (ICA) filled with metal coated polymer spheres has been studied as a novel approach to increase the flexibility, and hence the reliability of the adhesive compared to traditional metal filled ICAs. In this paper, we have investigated the rheological properties of the novel ICA to evaluate its applicability in practical use. The current work also involves the investigation of the mechanical properties including shear strength of the novel ICA. Spherical polymer particles (SPP) of sizes Ø6 μm and Ø30 μm were investigated in the present study. The results show minor differences in the rheological properties and the adhesion strength for adhesives filled with particles in different sizes. Filling SPP into the adhesive matrix increases the viscosity of the system monotonically and continuously, in excellent accordance with model systems previously reported in the literature. Furthermore, the novel ICA exhibits high mechanical shear strength, being comparable to the traditional solder joint technology and twice higher than the traditional metal filled ICA.Keywords
This publication has 10 references indexed in Scilit:
- Use of conductive adhesive for MEMS interconnection in military fuze applicationsPublished by SPIE-Intl Soc Optical Eng ,2010
- Rate-dependent properties of Sn-Ag-Cu based lead free solder jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2009
- Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applicationsPublished by Elsevier ,2006
- Modeling of particle arrangement in an isotropically conductive adhesive jointIEEE Transactions on Components and Packaging Technologies, 2005
- FLUID MECHANICS AND RHEOLOGY OF DENSE SUSPENSIONSAnnual Review of Fluid Mechanics, 2005
- Development of lead (Pb)-free interconnection materials for microelectronicsMetals and Materials, 1999
- Shear viscosity of settling suspensionsRheologica Acta, 1979
- Rheology of concentrated suspensionsJournal of Applied Polymer Science, 1971
- A Mechanism for Non-Newtonian Flow in Suspensions of Rigid SpheresTransactions of the Society of Rheology, 1959
- Eine neue Bestimmung der MoleküldimensionenAnnalen der Physik, 1906