On liquid film migration in aluminium–copper alloys
- 1 January 1998
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 46 (2) , 511-524
- https://doi.org/10.1016/s1359-6454(97)00267-x
Abstract
No abstract availableKeywords
This publication has 32 references indexed in Scilit:
- Chemically-induced liquid film migration with low lattice diffusivity relative to the migration rate in MoNi(W)Acta Metallurgica et Materialia, 1992
- Diffusion induced grain boundary migration (DIGM) and liquid film migration (LFM) in an Al-2.07 wt% Cu alloyActa Metallurgica et Materialia, 1991
- The grain boundary migration induced by diffusional coherency strain in MoNi alloyActa Metallurgica, 1989
- Migration of liquid film and grain boundary in MoNi induced by W diffusionActa Metallurgica, 1988
- The effect of curvature on the grain boundary migration induced by diffusional coherency strain in mo-ni alloyActa Metallurgica, 1987
- A critical test for the coherency strain effect on liquid film and grain boundary migration in MoNi(CoSn) alloyActa Metallurgica, 1987
- Chemically induced migration of liquid films and grain boundaries in MoNi(Fe) alloyActa Metallurgica, 1986
- Migration of liquid film and grain boundary in Mo-Ni induced by temperature changeActa Metallurgica, 1985
- Chemically induced migration of liquid film in W-Ni-Fe alloyActa Metallurgica, 1985
- Chemically driven growth of tungsten grains during sintering in liquid nickelActa Metallurgica, 1979