Direct formation of solder bump on Al pad using ultrasonic soldering
- 1 January 1988
- journal article
- research article
- Published by Wiley in Electronics and Communications in Japan (Part II: Electronics)
- Vol. 71 (10) , 32-39
- https://doi.org/10.1002/ecjb.4420711004
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Effects of Fe, Ni and Sn on Reaction Diffusion at Solder/Cu-Base-Alloys InterfaceJournal of the Japan Institute of Metals and Materials, 1984
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969
- SLT Device Metallurgy and its Monolithic ExtensionIBM Journal of Research and Development, 1969