Preparation and characterization of porous silica xerogel film for low dielectric application
- 1 October 1997
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 308-309, 495-500
- https://doi.org/10.1016/s0040-6090(97)00486-0
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
- Evaluation of SiO2 aerogel thin film with ultra low dielectric constant as an intermetal dielectricMicroelectronic Engineering, 1997
- Silica aerogel films at ambient pressureJournal of Non-Crystalline Solids, 1995
- Thin aerogel films for optical, thermal, acoustic and electronic applicationsJournal of Non-Crystalline Solids, 1995
- Silica aerogel films prepared at ambient pressure by using surface derivatization to induce reversible drying shrinkageNature, 1995
- Preparation Of Low-Density Xerogels At Ambient Pressure For Low K DielectricsMRS Proceedings, 1995
- Electrical and infrared dielectrical properties of silica aerogels and of silica-aerogel-based compositesApplied Physics A, 1993
- Dielectric properties of aerogelsJournal of Materials Research, 1993
- Preparation of V2O5 aerogels and aerogel coatingsJournal of Non-Crystalline Solids, 1992
- Plasma-enhanced chemically vapour-deposited silicon dioxide for metal/oxide/semiconductor structures on InSbThin Solid Films, 1982
- Production of Silica AerogelPhysica Scripta, 1981