Abstract
Ballistic electron emission microscopy has been used to study individual point defects, which are located at the CoSi2/Si(111) interface of thin ( 30) silicide films grown epitaxially on silicon substrates by molecular beam epitaxy. Clear evidence for trapping of point defects at dislocations is presented. The lateral distribution of the interfacial point defects is explained in terms of diffusion during an annealing step in the growth process.