Cleaved-coupled-cavity lasers with large cavity length ratios for enhanced stability

Abstract
The fabrication and operation of the first cleaved‐coupled‐cavity (C3) semiconductor lasers with large cavity length ratios are described. The internal cleaved facet is precisely positioned by photochemically etching a groove through most of the wafer. Single longitudinal mode operation is obtained over a temperature range of 21 °C and over a current range of threshold to greater than four times threshold. Sidemode suppression of 100:1 was measured when the laser was modulated at 350 MHz with an extinction ratio greater than 10:1. These results are experimentally and theoretically compared to approximately equal length C3 lasers.