Design and performance of a high density 3D microwave module
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 501-504
- https://doi.org/10.1109/mwsym.1997.602841
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Transitions and interconnects using coplanar waveguide and other three conductor transmission linesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- High yield GaAs flip-chip MMICs lead to low cost T/R modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chipsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002