High yield GaAs flip-chip MMICs lead to low cost T/R modules
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 5, 1707-1710
- https://doi.org/10.1109/mwsym.1994.335112
Abstract
A flip-chip design and assembly technique has been developed for GaAs MMICs resulting in lower fabrication costs and improved module yields. Plated bumps on the face of the MMIC are used as a replacement for wirebonds to interconnect all DC and RF si...Keywords
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