Effect of curing temperature on the mechanical properties of hydrogen silsesquioxane thin films
- 1 November 1998
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 335 (1-2) , 186-191
- https://doi.org/10.1016/s0040-6090(98)00881-5
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Cure of Hydrogen Silsesquioxane for Intermetal Dielectric ApplicationsMRS Proceedings, 1997
- Measurement of Thin Film Mechanical Properties Using NanoindentationMRS Bulletin, 1992