Measurement of Thin Film Mechanical Properties Using Nanoindentation
- 1 July 1992
- journal article
- Published by Springer Nature in MRS Bulletin
- Vol. 17 (7) , 28-33
- https://doi.org/10.1557/s0883769400041634
Abstract
One of the simplest ways to measure the mechanical properties of a thin film is to deform it on a very small scale. Because indentation testing with a sharp indenter is one convenient means to accomplish this, nanoindentation, or indentation testing at the nanometer scale, has become one of the most widely used techniques for measuring the mechanical properties of thin films. Other reasons for the popularity of nanoindentation stem from the ease with which a wide variety of mechanical properties can be measured without removing the film from its substrate and the ability to probe a surface at numerous points and spatially map its mechanical properties. The utility of the mapping capability is illustrated in Figure 1, which shows several small indentations made at selected points in a microelectronic device. The hardness and modulus of the device were determined at each point. In addition to microelectronics, nanoindentation has also proved useful in the study of optical coatings, hard coatings, and materials with surfaces modified by ion implantation and laser treatment.Keywords
This publication has 30 references indexed in Scilit:
- An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experimentsJournal of Materials Research, 1992
- Microscratch and load relaxation tests for ultra-thin filmsJournal of Materials Research, 1991
- Measuring stiffnesses and residual stresses of silicon nitride thin filmsJournal of Electronic Materials, 1990
- Mechanical properties of nanophase TiO2 as determined by nanoindentationJournal of Materials Research, 1990
- Effect of residual stress and adhesion on the hardness of copper films deposited on siliconJournal of Materials Research, 1990
- The mechanical properties of wear-resistant coatingsThin Solid Films, 1987
- Elastic analysis of some punch problems for a layered mediumInternational Journal of Solids and Structures, 1987
- Progress in the Development of a Mechanical Properties MicroprobeMRS Bulletin, 1986
- A note on the influence of residual stress on measured hardnessThe Journal of Strain Analysis for Engineering Design, 1984
- Performance and analysis of recording microhardness testsPhysica Status Solidi (a), 1977