Breakdown in silicon oxides (II)—correlation with Fe precipitates

Abstract
Thin silicon oxides of metal-oxide-semiconductor (MOS) capacitors were studied by transmission electron microscopy. The MOS capacitors were fabricated on silicon wafers which had been intentionally contaminated by Fe+ ion implantation. It was found that Fe precipitates crossing the SiO2/Si interface penetrated into the silicon oxide from the silicon substrate. They reduced the breakdown strength by inducing singularity points in the silicon oxide.

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