Microstructure and creep of eutectic indium/tin on copper and nickel substrates
- 1 June 1992
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 21 (6) , 647-652
- https://doi.org/10.1007/bf02655434
Abstract
No abstract availableKeywords
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- Solder Joint Reliability—Can Solder Creep?Soldering & Surface Mount Technology, 1990
- Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder JointsJournal of Electronic Packaging, 1989