Thermal analysis of solid-state devices using the boundary element method
- 1 July 1988
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 35 (7) , 1151-1153
- https://doi.org/10.1109/16.3380
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Analysis of Surface Mount Thermal and Thermal Stress PerformanceIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic CircuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- The Thermal Design of an LSI Single-Chip PackageIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- Thermal resistance of heterostructure lasersJournal of Applied Physics, 1975