Thermal stability of interfaces between metals and InP-based materials
- 1 May 1996
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 25 (5) , 715-719
- https://doi.org/10.1007/bf02666529
Abstract
No abstract availableKeywords
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- Ni, Pd, and Pt on GaAs: A comparative study of interfacial structures, compositions, and reacted film morphologiesJournal of Materials Research, 1987