Multilayer thin-film substrate for multichip packaging
- 6 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 276-281
- https://doi.org/10.1109/ecc.1988.12605
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Packaging Technology for the NEC SX SupercomputerIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Copper/polyimide Materials System for High Performance PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Reliability of Flip Chip Solder Bump Joints8th Reliability Physics Symposium, 1982
- A Novel Planar Multilevel Interconnection Technology Utilizing PolyimideIEEE Transactions on Parts, Hybrids, and Packaging, 1973
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969
- SLT Device Metallurgy and its Monolithic ExtensionIBM Journal of Research and Development, 1969