Relation between delamination and temperature cycling induced failures in plastic packaged devices
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 879-882
- https://doi.org/10.1109/33.62533
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Shear Stress Evaluation of Plastic PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Thin-Film Cracking and Wire Ball Shear in Plastic Dips Due to Temperature Cycle and Thermal ShockPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1987
- Stress-Induced Deformation of Aluminum Metallization in Plastic Molded Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985