Electromigration in thin film conductors

Publisher Website
Google Scholar
Abstract
The state of the art in understanding of electromigration induced failure is outlined in the following review. An overview of the basic principles responsible for electromigration in conductors is followed by an explanation of what the consequences of electron flow directed mass transport are in circuit wiring with an emphasis on the recent appreciation of the role of mechanical stress and where it comes from. The effects of thermal stress, microstructure and precipitation are discussed within this context. Finally, suggestions for further work are made.