Compact thermal modeling for temperature-aware design
- 7 June 2004
- proceedings article
- Published by Association for Computing Machinery (ACM)
- p. 878-883
- https://doi.org/10.1145/996566.996800
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Temperature-aware microarchitectureACM Transactions on Architecture and Code Optimization, 2004
- Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuitsProceedings of the IEEE, 2003
- Temperature-aware microarchitecturePublished by Association for Computing Machinery (ACM) ,2003
- 3-D Thermal-ADI: a linear-time chip level transient thermal simulatorIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2002
- 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integrationProceedings of the IEEE, 2001
- EDA challenges facing future microprocessor designIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2000
- WattchPublished by Association for Computing Machinery (ACM) ,2000
- A stochastic wire-length distribution for gigascale integration (GSI). I. Derivation and validationIEEE Transactions on Electron Devices, 1998
- Planning for performancePublished by Association for Computing Machinery (ACM) ,1998