Comparison of microwave and thermal cure of epoxy resins

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Abstract
Stoichiometric mixtures of DGEBA (diglycidyl ether of bisphenol A)/DDS (diaminodiphenyl sulfone) and DGEBA/mPDA (meta phenylene diamine) have been isothermally cured by electromagnetic radiation and conventional heating using thin film sample configurations. Fourier transform infrared spectroscopy (FTIR) was used to measure the extent of cure. Thermal mechanical analysis (TMA) was used to determine the glass transition temperatures directly from the cured thin film samples. Well‐defined glass transitions were observed in the TMA thermograph for both thermal and microwave cured samples. Significant increases in the reaction rates have been observed in the microwave cured DGEBA/DDS samples. Only slight increases in the reaction rates have been observed in the microwave cured DGEBA/mPDA samples. Higher glass transition temperatures were obtained in microwave cured samples compared to those of thermally cured ones after gelation. The magnitude of increases of glass transition temperature is much larger for the DGEBA/DDS system than DGEBA/mPDA system. The microwave radiation effect was much more significant in DGEBA/DDS system than in DGEBA/mPDA system. DiBenedetto's model was used to fit the experimental Tg data of both thermal and microwave cured epoxy resins.