Package Deformation And Cracking Mechanism Due To Reflow Soldering
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 295-298
- https://doi.org/10.1109/iemt.1993.639774
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Analysis of package cracking during reflow soldering processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Analytical and experimental study for designing molding compounds for surface mounting devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985