The Electrical Effect of Single-Chip CMOS Packages
- 1 December 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (4) , 593-603
- https://doi.org/10.1109/tchmt.1987.1134782
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Pulse Propagation Properties of Multilayer Ceramic Multichip Modules for VLSI CircuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Improved Electrical Performance Required for Future MOS PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- The Effects of Interconnections on High-Speed Logic CircuitsIEEE Transactions on Electronic Computers, 1963