Chemical vapour deposition of tantalum disilicide
- 1 April 1985
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 126 (3-4) , 227-232
- https://doi.org/10.1016/0040-6090(85)90315-3
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Properties of low-pressure CVD tungsten silicide for MOS VLSI interconnectionsIEEE Transactions on Electron Devices, 1983
- Universal chemical vapour deposition system for metallurgical coatingsThin Solid Films, 1983