Flux development for lead-free solders containing zinc
- 1 October 2000
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1160-1163
- https://doi.org/10.1007/s11664-000-0007-6
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic soldersJournal of Electronic Materials, 1997
- Investigation of multi-component lead-free soldersJournal of Electronic Materials, 1994