Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
- 1 July 1997
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 26 (7) , 783-790
- https://doi.org/10.1007/s11664-997-0252-z
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Characterization of eutectic Sn-Bi solder jointsJournal of Electronic Materials, 1992
- Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle FatigueJournal of Electronic Packaging, 1992
- Confirmation of Creep and Fatigue Damage in Pb/Sn Solder JointsJournal of Electronic Packaging, 1992
- Understanding the Cyclic Mechanical Behavior of Lead/Tin SolderJournal of Electronic Packaging, 1991
- Superplastic Creep of Eutectic Tin-Lead Solder JointsJournal of Electronic Packaging, 1991
- Creep in Shear of Experimental Solder JointsJournal of Electronic Packaging, 1990
- The Creep-Fatigue Interaction in Solders and Solder JointsJournal of Electronic Packaging, 1990
- Stress relaxation in superplastic materialsJournal of Materials Science, 1973
- Messung der Korngrenzenselbstdiffusion in polykristallinem ZinnPhysica Status Solidi (b), 1962
- Self-Diffusion in LeadThe Journal of Chemical Physics, 1955