Overmolded plastic pad array carriers (OMPAC): a low cost, high interconnect density IC packaging solution for consumer and industrial electronics
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Packaging technology for the NEC SX-3/SX-X SupercomputerPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002