Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process
- 6 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Investigations of Large PLCC Package Cracking During Surface Mount ExposureIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Computer Aided Stress Modeling for Optimizing Plastic Package Reliability8th Reliability Physics Symposium, 1985
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985