On the fatigue of solder subjected to isothermal cyclic shear
- 1 February 1993
- journal article
- Published by Elsevier in Scripta Metallurgica et Materialia
- Vol. 28 (3) , 349-353
- https://doi.org/10.1016/0956-716x(93)90440-4
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Isothermal Fatigue Behavior of Sn-Pb Solder JointsJournal of Electronic Packaging, 1990
- Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder jointsJournal of Electronic Materials, 1989
- Research on the Mechanism of Thermal Fatigue in Near‐eutectic Pb‐Sn SoldersSoldering & Surface Mount Technology, 1989
- Fatigue Failure in a Model SMD JointSoldering & Surface Mount Technology, 1989